3D Microelectronic Packaging

Provides comprehensive coverage of 3D microelectronic packagesExplains the fundamentals of using solder interconnects as micro-bumpsDemonstrates the advanced materials and processes used in 3D microelectronic packagesIntroduces readers to the 3D microelectronic package architecture and assembly process designHighlights quality and reliability concerns in 3D packagingOffers a detailed review of fault isolation and failure analysis in 3D packaging

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3D Microelectronic Packaging Yan Li, Deepak Goyal

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