Advanced Flip Chip Packaging
| Autor: | Ho-Ming Tong, Yi-Shao Lai, C.P. Wong |
|---|---|
| EAN: | 9781441957689 |
| eBook Format: | |
| Sprache: | Englisch |
| Produktart: | eBook |
| Veröffentlichungsdatum: | 20.03.2013 |
| Kategorie: | |
| Schlagworte: | Assembly Technologies Bumping Technology Electrical and Thermal Design Electromigration Flip Chip Packaging IC-Package-System-Integration IC Packaging Substrate Packaging Thermomechanical Reliability Thermomigration |
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Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
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