Advanced Thermal Management Materials

Provides an in-depth overview of copper, metal and aluminum materials and discusses the advantages and disadvantages of each in thermal management Discusses numerical simulation methods and techniques used in analysis of electronic devices and materials Covers system and component integration of advanced packaging materials Includes supplementary material: sn.pub/extras

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Advanced Thermal Management Materials Jiang, Guosheng, Kuang, Ken, Diao, Liyong

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