EAN: | 9781119592549 |
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Sachgruppe: | Technik |
Sprache: | Englisch |
Seitenzahl: | 348 |
Produktart: | Gebunden |
Herausgeber: | Mittal, K L |
Veröffentlichungsdatum: | 05.11.2019 |
Schlagworte: | Science |
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With 14 chapters from world-renowned researchers, this book offers an extraordinary commentary on the burgeoning current research activity in contact angle and wettability The present volume constitutes Volume 4 in the ongoing series Advances in Contact Angle, Wettability and Adhesion which was conceived with the intent to provide periodic updates on the research activity and salient developments in the fascinating arena of contact angle, wettability and adhesion. The book is divided into three parts: Part 1: Contact Angle and Wettability Aspects; Part 2: Surface Free Energy and Surface Tension Determination; and Part 3: Applied Aspects. The topics covered include: contact angle determination of talc powders; surface wetting at macro and nanoscale; wettability of plasma treated wood surfaces; wettability of ultrafiltration membranes; discussion of various models to determine the surface free energy of solid surfaces with the hope to find the best model; determination of surface free energy of skin and factors affecting it; determination of surface tension components of aqueous solutions using liquid film as a solid substrate; wetting of polybenzimidazole (PBI) and fuel cell performance; evaluation of sebum resistance of make-up products using contact angle measurements; contact angle hysteresis of pressure-sensitive adhesives; potential of surface nano-engineering and superhydrophobic surface in drag reduction; laser surface engineering of polymeric surfaces to enhance cell adhesion; sisal-green resin interfaces in green composites. Audience The information provided in this book will be of great interest and value to materials scientists, surface and chemical engineers as well as R&D, manufacturing, and quality control personnel in a host of industries and technological areas such as printing, textile, adhesive bonding, packaging, automotive, aerospace, composites, microfluidics, biomedical, paint, microelectronics, and nanotechnology.