Arbitrary Modeling of TSVs for 3D Integrated Circuits

Introduces a robust model that captures accurately all the loss modes of a TSV, coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region Enables readers to use a model which is technology dependent and can be used for any TSV configuration Reveals a novel on-chip wireless communication technique, based on TSV spiral inductors Equips readers for fast parasitic extraction of TSVs for 3D IC design Includes supplementary material: sn.pub/extras

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