Electrical Conductive Adhesives with Nanotechnologies
| Autor: | Yi (Grace) Li, Daniel Lu, C.P. Wong |
|---|---|
| EAN: | 9780387887838 |
| eBook Format: | |
| Sprache: | Englisch |
| Produktart: | eBook |
| Veröffentlichungsdatum: | 08.10.2009 |
| Kategorie: | |
| Schlagworte: | electrical conductive adhesives electronic devices electronic packaging integrated circuit lead-free solder nano techniques nanotechnology |
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'Electrical Conductive Adhesives with Nanotechnologies' begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
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