Fundamentals of Lead-Free Solder Interconnect Technology
Autor: | Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma |
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EAN: | 9781461492665 |
eBook Format: | |
Sprache: | Englisch |
Produktart: | eBook |
Veröffentlichungsdatum: | 05.11.2014 |
Untertitel: | From Microstructures to Reliability |
Kategorie: | |
Schlagworte: | electromigration lead-free electronics lead-free solder alloys lead-free soldering lead free soldering standards solder joint reliability surface mount assembly tin whiskering |
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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.