High-Density Integrated Electrocortical Neural Interfaces

High-Density Integrated Electrocortical Neural Interfaces provides a basic understanding, design strategies and implementation applications for electrocortical neural interfaces with a focus on integrated circuit design technologies. A wide variety of topics associated with the design and application of electrocortical neural implants are covered in this book. Written by leading experts in the field- Dr. Sohmyung Ha, Dr. Chul Kim, Dr. Patrick P. Mercier and Dr. Gert Cauwenberghs -the book discusses basic principles and practical design strategies of electrocorticography, electrode interfaces, signal acquisition, power delivery, data communication, and stimulation. In addition, an overview and critical review of the state-of-the-art research is included. These methodologies present a path towards the development of minimally invasive brain-computer interfaces capable of resolving microscale neural activity with wide-ranging coverage across the cortical surface. - Written by leading researchers in electrocorticography in brain-computer interfaces - Offers a unique focus on neural interface circuit design, from electrode to interface, circuit, powering, communication and encapsulation - Covers the newest ECoG interface systems and electrode interfaces for ECoG and biopotential sensing

Dr. Sohmyung Ha is an Assistant Professor of Electrical and Computer Engineering at the New York University Abu Dhabi, and as well as a Research Assistant Professor in the Department of Electrical and Computer Engineering at the Tandon School of Engineering, New York University, Brooklyn. Dr. Ha also serves as Principal Investigator at the Integrated BioElectronics Lab at NYU Abu Dhabi. He received both his M.S. and Ph.D. in Bioengineering from the University of California San Diego. Dr. Ha has contributed to numerous conference and journal publications, and currently serves as Associate Editor for Smart Health, an Elsevier journal for healthcare technologies.