RF and Microwave Microelectronics Packaging II
| Autor: | Ken Kuang, Rick Sturdivant |
|---|---|
| EAN: | 9783319516974 |
| eBook Format: | |
| Sprache: | Englisch |
| Produktart: | eBook |
| Veröffentlichungsdatum: | 09.03.2017 |
| Kategorie: | |
| Schlagworte: | Advanced power amplifiers Ceramic and Laminate packaging Chip size packaging for RF MEMS EMI shielding High power electronics Microwave and millimeter-wave frequencies Millimeter wave circu Thermal management system design Thin film substrate |
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This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
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