RF and Microwave Microelectronics Packaging
| Autor: | Ken Kuang, Franklin Kim, Sean Cahill |
|---|---|
| EAN: | 9781441909848 |
| eBook Format: | |
| Sprache: | Englisch |
| Produktart: | eBook |
| Veröffentlichungsdatum: | 01.12.2009 |
| Kategorie: | |
| Schlagworte: | 3D packaging RF and microwave microelectronics composite material electronic packaging electronics high-frequency electronics material packaging and processing methods simulation thermal management thermal mechanical designs |
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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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