Transactions on Engineering Technologies

Autor:	Gi-Chul Yang, Sio-Iong Ao, Len Gelman
EAN:	9789401788328
eBook Format:	PDF
Sprache:	Englisch
Produktart:	eBook
Veröffentlichungsdatum:	26.04.2014
Untertitel:	Special Volume of the World Congress on Engineering 2013
Kategorie:	Computer
Schlagworte:	Computational Intelligence Computational Statistics Control and Automation Image Engineering Internet Engineering Knowledge Engineering Manufacturing Engineering Software Engineering Wireless Networks

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This book contains revised and extended research articles written by prominent researchers participating in the international conference on Advances in Engineering Technologies and Physical Science (London, U.K., 3-5 July, 2013). Topics covered include mechanical engineering, bioengineering, internet engineering, image engineering, wireless networks, knowledge engineering, manufacturing engineering, and industrial applications. The book offers state of art of tremendous advances in engineering technologies and physical science and applications, and also serves as an excellent reference work for researchers and graduate students working with/on engineering technologies and physical science.

Professor Gi-Chul Yang is a professor in the Department of Multimedia Engineering, College of Engineering, Mokpo National University, South Korea, and has been the director of School of Information Engineering of the university.

Dr. Sio-Iong Ao finished his doctoral research in The University of Hong Kong and postdoctoral researches in the University of Oxford and Harvard University, and is a former visiting professor of Cranfield University, UK, and University of Wyoming, USA.

Professor Len Gelman is the Chair in Vibro-Acoustic Monitoring and Director of Centre of Vibro-Acoustics and Fatigue, Cranfield University, and is a Fellow of the British Institute of Non-Destructive Testing (BINDT) and UK Institution of Diagnostic Engineers, Chairman of the Condition Monitoring and Diagnostic Technology Committee of the BINDT and Director of the International Institute of Acoustics and Vibration (USA).