Transactions on Engineering Technologies

This book contains a selection of revised and extended research articles written by prominent researchers participating in the international conference on Advances in Engineering Technologies and Physical Science is held in London, UK, during July 7-9, 2021.

This book demonstrates revised and extended research articles written by prominent researchers participating in the conference. Topics covered include mechanical engineering, bioengineering, Internet engineering, image engineering, wireless networks, knowledge engineering, manufacturing engineering, and industrial applications. The book offers the state of the art of tremendous advances in engineering technologies and physical science and applications and also serves as an excellent reference work for researchers and graduate students working with/on engineering technologies and physical science and applications.

Dr. Sio-Iong Ao finished his doctoral research in The University of Hong Kong and postdoctoral researches in the University of Oxford and Harvard University and is Former Visiting Professor of Cranfield University, UK, and University of Wyoming, USA.

Prof. Len Gelman is Professor and Chair in Signal Processing and Condition Monitoring, and Director, the Center for Efficiency and Performance Engineering, School of Computing and Engineering, The University of Huddersfield, UK. He has more than 25 years of experience in signal processing and vibro-acoustic monitoring of complex mechanical systems (e.g., rotating, reciprocating machinery, etc.) both in industry and academia. He has been Principal Investigator on numerous contracts and grants, including grants from the US National Academy of Sciences, US National Research Council, US International Science Foundation, US Civilian Research and Development Foundation (twice), US MacArthur Foundation, Lady Davis, Israel, and Centro Volta, Italy. He is Principal Investigator on UK EPSRC, UK DTI (three times), UK Royal Society, Rolls Royce (two times), and Shell grants.