Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Autor:	Chakrabarty, Krishnendu Noia, Brandon
EAN:	9783319023779
Sachgruppe:	Technik
Sprache:	Englisch
Seitenzahl:	264
Produktart:	Gebunden
Veröffentlichungsdatum:	02.12.2013

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Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICsIncludes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule optimizationsEncompasses all aspects of test as related to 3D ICs, including pre-bond and post-bond test as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective

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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs Brandon Noia, Krishnendu Chakrabarty

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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs Chakrabarty, Krishnendu, Noia, Brandon

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